Flagship model for package board testing
Upper arm board alignment uses a high-resolution camera with twice the pixels as the previous model and a high-magnification lens (with 2× optical zoom) to help achieve accurate probing of the fine-pitch pads found on high-density package boards.
“Probe-down with contact check,” a new function, facilitates optimal probe stroke to minimize impact marks, reducing damage to pads.
| Number of arms | 4 (2 each, top and bottom) | |
|---|---|---|
| Mountable probes | 1172 series, 1072 series, 1073 series | |
| Number of test steps | Max. 999,999 steps | |
| Measurement parameters and measurement ranges | ||
| Resistance : | 40.00 μΩ to 100.0 MΩ | |
| Constant DC current continuity measurement |
400.0 m Ω to 1.000 k Ω | |
| Constant DC current resistance value measurement |
40.00 μ Ω to 400.0 K Ω | |
| Constant DC voltage resistance value measurement |
4.000 Ω to 40.00 M Ω | |
| Insulation resistance : | 1.000 kΩ to 100.0 GΩ | |
| Capacitance : | 100.0 fF to 10.00 μF | |
| Leak current measurement : | 100.0 μA to 10.00 mA | |
| High voltage resistance : | 1.000 kΩ to 100.0 GΩ | |
| Capacitance Insulation resistance : | 1.000 kΩ to 10.00 MΩ | |
| Open test : | 4.000 Ω to 4.000 MΩ | |
| Short test : | 400.0 mΩ to 40.00 kΩ | |
| LSI Connection test | 0.000 V to 12.00 V | |
| Measuring resistance | 10.00 Ω to 100.0 k Ω | |
| Measuring capacitance (For parts inspection) |
10.00 p F to 100.0 μ F | |
| Inductance : | 1.000 μH to 1.000 mH | |
| Judgment range | -99.9% to +999.9% or absolute value | |
| Minimum resolution of XY movement | 0.1 μm／pulse | |
| Minimum resolution of Z movement | 1 μm／pulse | |
| Minimum pad pitch | 35um (with CP1075-09) 44um (with CP1075-09) |
|
| Minimum pad size | 2um (with CP1075-09) 14um (with CP1075-09) |
|
| Measurement speed | Max. 76 points/ s (X-Y movements of 0.15 mm, 4-arm simultaneous probing, when capacitance measurement) | |
| Testable board size | Thickness : 0.1 mm to 2.5 mm (0.10 in) Outer dimensions : 50 mm (1.97 in) W × 50 mm (1.97 in) D to 400 mm (15.75 in) W × 330 mm (12.99 in) D |
|
| Maximum testable area | 398 mm (15.67 in) W × 304 mm (11.97 in) D | |
| Board clamping | Board 2-side chuck method (with tension function) | |
| Power supply | 200 V, 220 V, 230 V, 240 V AC single-phase (specify at time of order), 50/60 Hz, 5 kVA | |
| Dimensions and mass | 1355 mm (53.35 in) W × 1200 mm (47.25 in) H × 1265 mm (49.81 in) D, (Excluding protruding parts), 1,130 kg (39859.6 oz) | |
